65 Job openings found

1 Opening(s)
5.0 Year(s) To 10.0 Year(s)
2.40 LPA TO 3.00 LPA
Knowledge of DC Drives both Analog& Digital Drives. Knowledge of Furnace instruments. Knowledge of Electrical Equipments. Knowledge of Electrical Drawing. Working experience with SAP R/3 for procurement of material, Collecting all maintenance data, Major Job carried out in month for Preparation of monthly report. Notification made for the month for Correlation with delay in the production. Planning & ...
3 Opening(s)
5.6 Year(s) To 7.5 Year(s)
11.20 LPA TO 15.00 LPA
Role : Application Developer  Role Description : Design, build and configure applications to meet business process and application requirements.                                                               ...
3 Opening(s)
3.5 Year(s) To 5.4 Year(s)
7.00 LPA TO 10.80 LPA
Role Description :    Design, build and configure applications to meet business process and application requirements.                                                                     ...
1 Opening(s)
0 To 1.0 Year(s)
1.68 LPA TO 2.00 LPA
Post: PCB Design Engineer Education:  BE Electronics Skills & Abilities: TECHNICAL · PCB Designing  Basic Knowledge of C Knowledge of Analog and Digital circuit design Knowledge of Embedded C Software handling like: Altium Designer 18.0, OR-CAD, Eagle, MP-LAB,     AUTO-CAD, View-mate, Saturn, CAM 350 (PCB Manufacturing software).MACH3 Responsibilities:   Schematic & PCB Layout Design as per IPC2221B Standard guidelines     Schematic and PCB Footprint library Creation     PCB Penalization, PCB Verification and BOM Creation     Gerber file preparation for PCB fabrication     Stencil, ICT and Selective pallet data development     Generate Pick & Place data for PCB assembly     Co-ordination with mechanical and CFT team for PCB fitment related issue ...
1 Opening(s)
7.0 Year(s) To 12.0 Year(s)
5.00 LPA TO 7.00 LPA
Handling of continues carburizing Furnaces(Made By Dongwo surface Tech Ind). Handle all Heat Treatment Shop Floor Including Shot Blasting Machine, Shot Peening Machine, Thread Softening Machine, MPI Machine, Straightening Machine. Checking of samples (Case Depth, core hardness, Micro Structure) Checking of inward samples (surface hardness, microstructure, grain structure) Handle Endo Gas Generator Handling of wet Lab(Cutting, Mounting, Polishing.) Operating of Brinell Hardness Tester, Rockwell Hardness Tester, Vickers Hardness Tester, Microscope Millipore Checking, Spectro Test. Fill up all JH Sheets, DWM data OEE Sheets. Utility Consumption aw Material Inspection for crack, Hardness, Micro-structure, Grain size Measurement, Decarburization level and Inclusion level measurement and defects if any with traceable documents. Inspection of heat treated parts for surface hardness, Effective case depth, microstructure analysis, decarburization level (if any) and defects if any with traceable documents. Research & Development work like the selection of an appropriate heat treatment cycle without sacrificing customer requirements. Monitoring the heat treatment process continuously and taking the remedial action if any deviations are found. Heat treatment vendor development, Vendor process monitoring, and product inspection. Maintaining the Metallurgical equipment that is as follows Metallurgical Microscope ( Leica ) – DM 2800 Micro Vickers Hardness Tester  ( Future tech) – FM 300 Vickers hardness tester ( Future tech) – FV 800 Digital Rockwell Hardness Tester ( Future tech) – FR – 3e Analog Rockwell Hardness Tester. Abrasive cutting machine ( Chennai metco )  Molding machine ( Chennai Metco ) Double Disc Polishing Machine ( Chennai Metco ) Belt grinding machine ( Chennai Metco) Brinell Hardness Tester Muffle Furnace (Techno). Carrying out of furnace and process validation with proper traceable documents and calibrating the metallurgical instruments with appropriate service parties as per schedule.   Job Location: Waluj MIDC, Aurangabad   Send CV on Career@paradiseplacement.co.in   for more details call on 9765567506 / 7249840333 
1 Opening(s)
3.0 Year(s) To 6.0 Year(s)
3.00 LPA TO 3.80 LPA
Post: Heat Treatment Engineer / Assistant Manager   Experience : 3 to 6 Years   Salary: 4 LPA   JOB RESPONSIBILITIES:-   Handling of continues carburizing Furnaces(Made By Dongwo surface Tech Ind). Handle all Heat Treatment Shop Floor Including Shot Blasting Machine, Shot Peening Machine, Thread Softening Machine, MPI Machine, Straightening Machine. Checking of samples (Case Depth, core hardness, Micro Structure) Checking of inward samples (surface hardness, microstructure, grain structure) Handle Endo Gas Generator Handling of wet Lab(Cutting, Mounting, Polishing.) Opearting of Brinell Hardness Tester, Rockwell Hardness Tester, Vickers Hardness Tester, Microscope Millipore Checking, Spectro Test. Fill up all JH Sheets, DWM data OEE Sheets. Utility Consumption aw Material Inspection for crack, Hardness, Micro-structure, Grain size Measurement, Decarburization level and Inclusion level measurement and defects if any with traceable documents. Inspection of heat treated parts for surface hardness, Effective case depth, microstructure analysis, decarburization level (if any) and defects if any with traceable documents. Research & Development work like the selection of an appropriate heat treatment cycle without sacrificing customer requirements. Monitoring the heat treatment process continuously and taking the remedial action if any deviations are found. Heat treatment vendor development, Vendor process monitoring, and product inspection. Maintaining the Metallurgical equipment that is as follows Metallurgical Microscope ( Leica ) – DM 2800 Micro Vickers Hardness Tester  ( Future tech) – FM 300 Vickers hardness tester ( Future tech) – FV 800 Digital Rockwell Hardness Tester ( Future tech) – FR – 3e Analog Rockwell Hardness Tester. Abrasive cutting machine ( Chennai metco )  Molding machine ( Chennai Metco ) Double Disc Polishing Machine ( Chennai Metco ) Belt grinding machine ( Chennai Metco) Brinell Hardness Tester Muffle Furnace (Techno). Carrying out of furnace and process validation with proper traceable documents and calibrating the metallurgical instruments with appropriate service parties as per schedule.   Job Location: Chikalthana MIDC, Aurangabad   Send CV on Career@paradiseplacement.co.in   for more details call on 7249840333   
3 Opening(s)
0 To 3.0 Year(s)
1.44 LPA TO 2.40 LPA
Requirement of Design Engineer for Design Department. Positions : 3 Requirements : Female candidates only  BE ( Mechanical ), Freshers also welcome Must have knowledge of Autocad. CAD designing for pattern splitting Monitoring Pattern activity in Cad. Proficiency in Using Solidwork Software in Designing & Drafting Proven expertise in new component-process development or Process Design, Planning and manufacturing Job Location :  Aurangabad For more deatails call on ...
1 Opening(s)
Not Mentioned To 2.0 Year(s)
1.40 LPA TO 1.80 LPA
      Job Description Preparing RFQ, BOM & Feasibility of Trims, LMR, Plastic, FRP & Foam parts. Design as well as Modification in parts as per manufacturing feasibility. Making modelling, assembly & drawing of Part, Pattern, Tools, Gauges, Fixtures. Analysis of CAD data & understand customer requirements and expectations. Converting Non Parametric model into Parametric model & ...
1 Opening(s)
10.0 Year(s) To 20.0 Year(s)
40.00 LPA TO 45.00 LPA
Sr Electronics hardware Design engineer will be responsible for executing high-speed digital and mixed signal design projects for the Mark Vie product. You will work as part of the cross functional Global team of engineers creating and improving a state-of-the-art platform for use in every kind of power generation application. Essential ...
1 Opening(s)
5.0 Year(s) To 8.0 Year(s)
5.00 LPA TO 8.00 LPA
Skills and Knowledge: Electronics Hardware Design: Strong knowledge of analog, digital and mixed signal circuit design, schematic capture, and PCB layout tools. Microcontrollers and Embedded Systems: Experience with microcontroller, DSP & ARM controller programming and interfacing with various sensors and actuators. Wireless Communication: Familiarity with wireless protocols such as Wi-Fi, Bluetooth, ...

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