5 Opening(s)
0 To 1.0 Year(s)
2.00 LPA TO 3.50 LPA
Good knowledge of embedded C/C++ is must for a fresher candidate.
Embedded Software Role
– You will serve as the technical lead for embedded systems through
the entire product life cycle, from inception and roadmap through design and into mass-production
support. Design and implement robust digital designs for various embedded devices. ...
1 Opening(s)
2.0 Year(s) To 3.0 Year(s)
2.40 LPA TO 3.00 LPA
Duties & Responsibilities:
• Design and implement software of embedded devices and systems from requirements to production and commercial deployment
• Design, develop, code, test and debug system software
• Review code and design
• Analyze and enhance efficiency, stability and scalability of system resources
• Integrate and validate new product designs
• Support software QA ...
1 Opening(s)
1.0 Year(s) To 2.0 Year(s)
3.60 LPA TO 4.80 LPA
Responsibilities:
Design and implement software of embedded devices and systems from requirements to production and commercial deployment
Design, develop, code, test and debug system software
Review code and design
Analyze and enhance efficiency, stability and scalability of system resources
Integrate and validate new product designs
Support software QA and optimize I/O performance
Provide post production support
Interface with ...
1 Opening(s)
5.0 Year(s) To 7.0 Year(s)
Not Disclosed by Recruiter
RF Engineer
Job Description:We are looking for a proactive RF Engineer with the following skill set:
Technical Skills:
Basics of RF, Analog, Digital electronics
Embedded systems design, test and debug.
Microcontrollers (preferably arm based microcontroller experience)
Experience with-
FPGA eval boards
USRP
SDR
GNU Radio
Programming language exposure:
Embedded C,
C
Python
VHDL/Verilog (preferable)
Lab Equipment skills:
DC Power supply
Oscilloscope
Spectrum Analyzer
VNA
RF Equipment
Assembly handling.
Desirable:
Proficient in basics of Electronic ...
1 Opening(s)
1.5 Year(s) To 2.0 Year(s)
3.00 LPA TO 4.00 LPA
Responsibilities:
· Interface of memories DDR2, DDR3, Flash, EEPROM etc on Xilinx, Intel SoC customized developed boards
· Porting Operating system on HPS side and develop kernel and driver according to board design
· Communication interfaces like Ethernet, USB3.0, USB 2.0, SPI, I2C, UART etc. PHY development
· High speed interfaces like LVDS, JECDC ...