2 Opening(s)
3.0 Year(s) To 10.0 Year(s)
3.00 LPA TO 12.00 LPA
Candidate should have passion to develop the hardware of the Product containing? 32-bit controllers, FPGA, CPLD, Logic chips, Buffer chips, Flash/EEPROM/FRAM chips?Various sensors (e.g. photocoupler, LDR, Magnetic Encoder, Temperature etc.), RFiD tags?Keypad, Relay, Solenoid, various types of LCD (Graphical, 7 segment), Thermal Printer?RS485, I2C, SPI, CAN2.0b, JTAG, USB, Wi-Fi, Ethernet, ...
1 Opening(s)
1.5 Year(s) To 2.0 Year(s)
3.00 LPA TO 4.00 LPA
Responsibilities:
· Interface of memories DDR2, DDR3, Flash, EEPROM etc on Xilinx, Intel SoC customized developed boards
· Porting Operating system on HPS side and develop kernel and driver according to board design
· Communication interfaces like Ethernet, USB3.0, USB 2.0, SPI, I2C, UART etc. PHY development
· High speed interfaces like LVDS, JECDC ...
1 Opening(s)
2.0 Year(s) To 8.0 Year(s)
6.50 LPA TO 10.00 LPA
JD: Firmware Engineer (Experience : 2-4Yrs)
Expert handling ARM Cortex M0-M7 based Projects.
Expert in finding the bugs and error in code during running project and able to make a final solution .
Handled unexpected issues and minimize bugs in firmware by focusing on practical rules that keep bugs out-while also improving the ...