1 Opening(s)
10.0 Year(s) To 20.0 Year(s)
40.00 LPA TO 45.00 LPA
Sr Electronics hardware Design engineer will be responsible for executing high-speed digital and mixed signal design projects for the Mark Vie product. You will work as part of the cross functional Global team of engineers creating and improving a state-of-the-art platform for use in every kind of power generation application.
Essential ...
1 Opening(s)
5.0 Year(s) To 8.0 Year(s)
Not Disclosed by Recruiter
Analog Circuit design, sensor design and hardware development of Microcontroller based Instrumentation / Equipments (preferably in Ultrasonic Flow Meter).
Will be responsible for sensor & analog front end design and integration with Microprocessor based hardware.
Design of Signal processing requirement and Algos.
Will be responsible for sensor & analog front end design and ...
1 Opening(s)
0 To 4.0 Year(s)
1.00 LPA TO 5.00 LPA
hands on experience with products like HID Vertex, Honeywell
Controllers, GE, CCTV (IP Based Systemand Analog System), Fire Alarm System & Public address system.
Commissioning of Access Controls with hands on experience
with products like HID Vertex, Honeywell Controllers, GECommissioning of CCTV (IP Based System and Analog System
).Definin
hands on experience with products like ...
1 Opening(s)
7.0 Year(s) To 10.0 Year(s)
Not Disclosed by Recruiter
We are having an urgent opening for the position of Embedded Hardware Engineer for a reputed Company at the Mumbai(Mulund (West) location.
Embedded Hardware Engineer with experience in designing circuits for process instruments.
Candidate Eligibility:
Should be qualified Electronics Hardware Engineer with 3 to 6 years of R&D experience in Embedded System;
Experience in PCB designing using PADS / ...
1 Opening(s)
5.0 Year(s) To 8.0 Year(s)
5.00 LPA TO 15.00 LPA
Position Overview:
As an Electronics Hardware Design Engineer, you will play a key role in the development of cutting-edge electronic hardware systems. You will be responsible for designing, prototyping, and testing electronic circuits and systems, ensuring they meet performance, reliability, and regulatory requirements. This role offers the opportunity to work on ...
1 Opening(s)
7.0 Year(s) To 15.0 Year(s)
10.00 LPA TO 15.00 LPA
Job descriptionPosition Overview: As the Team Lead for Embedded Software and Hardware Development in our Research and Development (R&D) department, you will play a pivotal role in leading a multidisciplinary team of engineers to design, develop, and deliver cutting-edge embedded systems for our products. You will be responsible for overseeing ...
1 Opening(s)
5.0 Year(s) To 7.0 Year(s)
Not Disclosed by Recruiter
RF Engineer
Job Description:We are looking for a proactive RF Engineer with the following skill set:
Technical Skills:
Basics of RF, Analog, Digital electronics
Embedded systems design, test and debug.
Microcontrollers (preferably arm based microcontroller experience)
Experience with-
FPGA eval boards
USRP
SDR
GNU Radio
Programming language exposure:
Embedded C,
C
Python
VHDL/Verilog (preferable)
Lab Equipment skills:
DC Power supply
Oscilloscope
Spectrum Analyzer
VNA
RF Equipment
Assembly handling.
Desirable:
Proficient in basics of Electronic ...
1 Opening(s)
0 To 5.0 Year(s)
1.00 LPA TO 8.00 LPA
Should have good experience in PLC and HMI/SCADA programming skills
Should have good knowledge in Allen Bradley and Siemens PLC.
Should have good exposure in Analog Instruments and programming
Should have good Knowledge in VFD programming and PID controls
Should have good experience in PLC and HMI/SCADA programming skills
Should have good knowledge in Allen ...
1 Opening(s)
0 To 2.0 Year(s)
2.00 LPA TO 4.00 LPA
Job Title-Stamping Die Design EngineerEducationalQualification -Diploma holders from NTTF, CITD, IGTR are preferred.BE, Mechanic al Engg less preferred.Domain-Stamping Die DesignSkill Set-Catia V5 / NXJob Description Sheet Metal
(Press tool) Die designer f or 3D & 2D die designs for Automotive BIW & Structural parts.Should be proficient with Catia V5 /NX Solid ...
1 Opening(s)
0 To 1.0 Year(s)
1.00 LPA TO 5.00 LPA
Job Description : Lead Thermal SystemsDesign ownership of Fuel Cell system-s Thermal Mangement SystemDevelopment of thermal management system simulation model enabling
control optimization across vehcile platforms.Support to systems engineering team with auxiliary sysetem simulations.Sizing and development of thermal system and aggreagates.Verification and validation of thermal system aggreagate perfomances.Perform DOEs on vehicle ...