48 Job openings found

1 Opening(s)
3.0 Year(s) To 12.0 Year(s)
Not Disclosed by Recruiter
A fully integrated provider of technology, engineering and construction solutions to the energy industry. For more than a century, customers have trusted McDermott to design and build end-to-end infrastructure and technology solutions—from the wellhead to the storage tank—to transport and transform oil and gas into the products the world needs today.     Location      : Gurgaon Experience  ...
1 Opening(s)
7.0 Year(s) To 15.0 Year(s)
10.00 LPA TO 15.00 LPA
Job descriptionPosition Overview: As the Team Lead for Embedded Software and Hardware Development in our Research and Development (R&D) department, you will play a pivotal role in leading a multidisciplinary team of engineers to design, develop, and deliver cutting-edge embedded systems for our products. You will be responsible for overseeing ...
5 Opening(s)
2.0 Year(s) To 9.0 Year(s)
7.00 LPA TO 8.00 LPA
  MANDATORY SKILLSDesigning and development of Embedded/IOT productsaccording to specifications.Microcontroller – 16/32bit designs. technical skills Hands on experience in complete embedded systemdevelopment lifecycleCircuit designMicrocontroller – 16/32bit designs. Basic Knowledge on Camera and Wireless Devices like BLE,GSM and GPS.Digital and Analogue sensorsUART, I2C, SPI, RS232.LDO and Regulators.DFMEA and De-ratting, Design calculations, designdocumentation.EMI/EMC KnowledgeAnalytical and debugging ...
1 Opening(s)
3.0 Year(s) To 5.0 Year(s)
7.00 LPA TO 15.00 LPA
Exp: 3+ yrs to 5yrs Skills (must have) ~experience in C or C++ ~good understanding of Linux environment ~should have worked on kernel development, building Linux image, building and modification of Linux device drivers ~should know protocols like SPI, I2C, UART etc   Roles and responsibilities ~ Resource would be building Linux images ~ Resource would be making changes to ...
1 Opening(s)
1.0 Year(s) To 2.0 Year(s)
1.00 LPA TO 2.00 LPA
Job Location- Bhosari Pune JOB DESCRIPTION Background: Bachelor's degree in ECE, Electrical, E&TC, Electronics Engineering 0-2 years of relevant experience Requirements (in the order of their importance): Proficient knowledge of electronics hardware in one or more of the following domains: power electronics, analog electronics, digital electronics Knowledge of communication protocols such as CAN, I2C, SPI, etc. Experience in the ...
2 Opening(s)
3.0 Year(s) To 10.0 Year(s)
3.00 LPA TO 12.00 LPA
Candidate should have passion to develop the hardware of the Product containing? 32-bit controllers, FPGA, CPLD, Logic chips, Buffer chips, Flash/EEPROM/FRAM chips?Various sensors (e.g. photocoupler, LDR, Magnetic Encoder, Temperature etc.), RFiD tags?Keypad, Relay, Solenoid, various types of LCD (Graphical, 7 segment), Thermal Printer?RS485, I2C, SPI, CAN2.0b, JTAG, USB, Wi-Fi, Ethernet, ...
1 Opening(s)
1.0 Year(s) To 3.0 Year(s)
2.00 LPA TO 4.00 LPA
1) BE (ETRX/EXTC) 2-5 Years Experienced Engineers, On HARD Core 32 bit ARM microcontroller-based electronics Development.2) Expertise in C / C + + Programming, Firmware development for ARM Cortex Microcontroller, Like STM32 series or alike,3) Knowledge of Cube Ide, development environment, Knowledge of programming various Low-level device drivers, and SFR's.4) Sound knowledge of ...
5 Opening(s)
0 To 1.0 Year(s)
2.00 LPA TO 3.50 LPA
Good knowledge of embedded C/C++ is must for a fresher candidate. Embedded Software Role – You will serve as the technical lead for embedded systems through the entire product life cycle, from inception and roadmap through design and into mass-production support. Design and implement robust digital designs for various embedded devices. ...
1 Opening(s)
4.0 Year(s) To 7.0 Year(s)
5.00 LPA TO 10.00 LPA
Skills and competencies: ? Must have knowledge of Automotive protocols: ? CAN , ? XCP , ? SPI , I ? 2C. ? Must have worked on automation test tools: ? Vector CANOe, ? vTestStudio, ? CAPL. ? Worked on requirement management tools like: ? JIRA ? Aware of Defect management. ? Shall have worked in Diagnostic testing based on ...
1 Opening(s)
1.5 Year(s) To 2.0 Year(s)
3.00 LPA TO 4.00 LPA
Responsibilities:   · Interface of memories DDR2, DDR3, Flash, EEPROM etc on Xilinx, Intel SoC customized developed boards · Porting Operating system on HPS side and develop kernel and driver according to board design · Communication interfaces like Ethernet, USB3.0, USB 2.0, SPI, I2C, UART etc. PHY development · High speed interfaces like LVDS, JECDC ...

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