1 Opening(s)
15.0 Year(s) To 25.0 Year(s)
Not Disclosed by Recruiter
Job Title : Erection Expert – Full Span
Job Description
· Developing Erection methodology to be adopted
· Planning the execution of Erection process
· Understanding the drawing and implementation
· To train the team in execution of erection
· To drive the erection team to execute as per planning
· Responsible for project activity ...
1 Opening(s)
1.0 Year(s) To 3.0 Year(s)
1.08 LPA TO 1.68 LPA
We are Currently Looking For Computer Operator for Reputed Agriculture Company at RAIPUR location Candidate should be have good knowledge of MS Office, excellent knowledge of MS Excel and good typing speed,Maintain a sufficient record of office supplies Provide administrative services to the office manager Answer, screen and forward any incoming phone calls while providing basic information ...
1 Opening(s)
6.0 Year(s) To 8.0 Year(s)
10.00 LPA TO 14.00 LPA
Job Profile:
Manage, develop, and mentor a fast-paced team of Solutions Engineers who respond to client requests, reproduce, and troubleshoot issues, and dive into the 400+ integrations.
Create an inspiring team environment with an open communication culture.
Delegate tasks and set deadlines.
Oversee day-to-day operation.
Monitor team performance and report on metrics.
Oversee demo training ...
5 Opening(s)
4.0 Year(s) To 6.0 Year(s)
Not Disclosed by Recruiter
Job DescriptionThe Dell Boomi Developer will build, orchestrate, and deploy complex integration patterns between system, process and service layers. This person will also interpret and translate requirements to develop Boomi atmosphere services and integrations in a continuous integration/continuous deployment model using Agile methodology.Design, develop, deploy and maintain integration processes between ...
1 Opening(s)
2.0 Year(s) To 5.0 Year(s)
2.40 LPA TO 3.00 LPA
Observe machine operations to ensure quality and conformity of filled or packaged products to standards.Adjust machine components and machine tension and pressure according to size or processing angle of product.Tend or operate machine that packages product.Remove finished packaged items from machine and separate rejected items.Regulate machine flow, speed, or temperature.Stop ...
1 Opening(s)
3.0 Year(s) To 5.0 Year(s)
1.80 LPA TO 3.00 LPA
Observe machine operations to ensure quality and conformity of filled or packaged products to standards.Adjust machine components and machine tension and pressure according to size or processing angle of product.Tend or operate machine that packages product.Remove finished packaged items from machine and separate rejected items.Regulate machine flow, speed, or temperature.Stop ...
1 Opening(s)
5.0 Year(s) To 7.0 Year(s)
5.00 LPA TO 7.00 LPA
Skill Requirement:
· Hardware simulation · Hardware tests ·Schematic capture and tools ·Know how of CRO, function generator, Multi-meter and other tools ·EMI/EMC testing and analysis ·Thermal testing of hardware ·Bare PCB analysis ·Using current/voltage probes ·Signal & Power integrity analysis ·Component selection ·Hardware debugging ·RF fundamentals guidelines ·High-speed digital ...
3 Opening(s)
7.0 Year(s) To 10.0 Year(s)
20.00 LPA TO 28.00 LPA
Key Responsibilities:
Design, architect, and engineer big data solutions
Develop a modern data analytics lake house
Propose and standardize ELT, BI, AI, governance, and analytics
Publish enterprise ingress, development, transform, egress, consumption guidelines
Instrument monitoring, self-healing, and self-describing data pipelines to meet tier 1 OLAs/OpX: i.e., own operational outcomes.
Implement continuous integration, continuous deployment, DevOPs practice
Create, ...
7 Opening(s)
1.0 Year(s) To 3.0 Year(s)
0.00 LPA TO 2.88 LPA
Process: US Mortgage Title Insurance
Job description:
Inquiry on Insurance Property
Research on Property documents i.e. area/cost/owner details
Complete research & sending reports to Client.
Skills Required:
Graduation is mandatory.
Excellent English communication skills, both reading, and typing.
Candidates must have an English typing speed of at least 25 WPM & Accuracy of 100%.
Require above 2 years experience.
CTC: ...
1 Opening(s)
1.5 Year(s) To 2.0 Year(s)
3.00 LPA TO 4.00 LPA
Responsibilities:
· Interface of memories DDR2, DDR3, Flash, EEPROM etc on Xilinx, Intel SoC customized developed boards
· Porting Operating system on HPS side and develop kernel and driver according to board design
· Communication interfaces like Ethernet, USB3.0, USB 2.0, SPI, I2C, UART etc. PHY development
· High speed interfaces like LVDS, JECDC ...